Method and apparatus for detecting cracks and delamination in composite materials

ABSTRACT

A method is disclosed for testing for delamination of a first composite component from a second composite component a composite material. The method comprises coupling a broad-band actuator to the composite material and connecting sweeping frequencies to the broad-band actuator for vibrating the composite material. An acoustic sensor is coupled to the composite material for measuring a resonant frequency curve of the vibrating composite material. The measured resonant frequency curve of the vibrating composite material is compared with a reference resonant frequency curve. A delaminated composite material produces a change in the measured resonant frequency curve relative to the reference resonant frequency curve. The method is suitable for detecting delamination in fuel cells as well as ceramic body armor.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates broadly to methods and apparatus employed in the manufacture of composite materials. More particularly, the invention relates to apparatus and methods for quality control of composite materials such as fuel cell and composite ceramic body armor.

2. Description of the Related Art

Any discussion of the prior art throughout the specification should in no way be considered as an admission that such prior art is widely known or forms part of the common knowledge in the field. State-of-the-art silicon solar cell production is based on highly automated belt-type conveyor configurations. The as-cut p-type Si wafer is typically first subjected to chemical etching which removes saw damaged layers from both front and back surfaces of the wafer or edge damage from the laser cutting of silicon ribbons and then passes through the consecutive process steps including phosphorous diffusion to form a pin junction; the deposition and firing of an antireflection S₃N₄coating, the creation of the front-side metal contact grid and Al back-side metal contact. Other modifications to optimize the process are also used in variants of these solar cell process steps. Finally, the individual solar cells are connected sequentially in strings, to achieve required voltage and current, and the strings are laminated into solar panels.

The PV industry, with crystalline silicon as a dominant segment, is rapidly expanding to meet growing renewable energy demands all over the world. The silicon wafer is a major contributor to the overall cost of the solar cell: currently up to 75% of the overall cost. One of the major technological problems is the identification and elimination of sources of wafers' mechanical defects such as thermo-elastic stresses and cracks leading to the loss of wafer integrity and ultimately to the breakage of as-grown and processed Si wafers and of PV cell based on these wafers.

The price of silicon raw material has grown substantially in the last three years due to a world-wide shortage of polycrystalline silicon feedstock. To compensate for the feedstock shortage, solar Si wafers are sliced thinner to a thickness of less than 100 microns [i. Wohlgemuth, M. Narayanan, R. Clark. T. Koval, S. Roncin, M. Bennett, D. Cunningham, D. Amin, J. Creager “Large-scale PV module manufacturing using ultra-thin polycrystalline silicon solar cells” Conference Record of the Thirty-First IEEE Photovoltaic Specialist Conference (IEEE Cat. No. 05CH37608), 2005, Pages 1023-1026]. Wafer areas have also been increased to reduce overall production costs, and larger sizes, up to 210 mm by 210 mm, are now available.

Thinner and larger wafers are, however, more difficult to handle during production, this leads to a reduction in yield due to increased breakage especially in high speed automated manufacture. In-line wafer breakage reduces equipment throughput as a result of down time required for cleaning in-line equipment, and removing broken wafers from fixtures.

There is, therefore, a recognized need for devices and a methodology for fast in-line quality control methods and apparatus. Common problem leading to wafer breakage is related to small cracks that under thermal or mechanical stress cause wafer's mechanical fracture.

Further, it is recognized that impact of a particular crack on wafer's mechanical property depends on the size of the crack and its location within the wafer.

The majority of the methods presented in the prior art are based on imaging techniques, comprising capturing and processing an image of a wafer in order to determine its spatial irregularities.

Scanning Acoustic Microscopy (SAM) is an imaging technique using 150 MHz pulses for precise identification and visualization of micro-cracks as small as 10 microns. The cracks are identified as acoustic impedance discontinuity of wafer at the crack region [M. C. Bhardwaj “Principles and methods of ultrasonic characterization of materials” Advanced ceramic materials, 1 (1986) pp311-324]. The steps of SAM technique including, immersion of wafer into deionized water, mapping of the pulse amplitude, and data analyses are each relatively slow, so that the full testing procedure even in its automated version can occupy several minutes of precious manufacturing time. This evidently makes SAM unsuitable for in-line applications where no more than a few seconds per wafer is acceptable for quality inspection.

Another approach is offered by an optical inspection imaging where relatively large cracks are visualized by a light transmission technique [E. Wieland, A. Herguth, A. Trummer, S. Wansleben, P. Path “Optical micro-crack detection in combination with stability testing for in-line-inspection of wafers and cells”, Proceedings of 20th EUPVSEC (Barcelona, 2005) pp. 3242-3245]. This technique, however, lacks the capability to observe small cracks at the wafers periphery. The optical inspection is also non-applicable to processed wafers having back-side Al contact and to complete solar cells. An additional limitation of the transmission technique is that tightly closed cracks with width of about 1 micron are not detectable due to the optical diffraction limit.

Recently reported data on luminescence imaging [T. Trupke, R. A. Bardos, M. C. Schubert, W. Warta, “Photoluminescence imaging of silicon wafers”, Applied Physics Letters (2006), Volume 89, Issue 4, 44107; T. Fuyuki, H. Kondo, T. Yamazaki, Yu. Takahashi, Yu. Uraoka “Photographic surveying of minority carrier diffusion length in polycrystalline silicon solar cells by electroluminescence” Appl Phys Letters 86, 262108 (2005)] is particularly developed for testing of indirect band-gap semiconductor devices such as silicon solar cells.

As an imaging technique the method's speed is limited by implemented image recognition software which needs to perform a substantial computational task of analyzing complex luminescence image of a wafer. Another drawback of the method is that other defects such as surface scratches and dislocation slip lines can be misinterpreted as cracks thus leading to false positive answers. The application of this method to identification of electrically isolated or poorly connected regions such as those caused by breaks in the metal pattern was disclosed in details in an international patent application PCT/AU2007/000595.

Ultrasonic lock-in thermography is sufficiently sensitive, however it requires a longer measuring period for signal averaging due to low infrared intensity [J. P Rakotoniaina, O. Breitenstein, M. H. Al Rifai, D. Franke, A. Schnieder “Detection of cracks on silicon wafers and solar cells by lock-in ultrasound thermography”. Proceedings of PV Solar conference (Paris, June 2004), pp. 640-643].

A new non-imaging experimental algorithm for fast crack control using Resonance Ultrasonic Vibrations (RUV) was disclosed in the paper [A. Belyaev, O. Polupan, W. Dallas, S. Ostapenko, D. Hess, J. Wohlgemuth “Crack detection and analyses using resonance ultrasonic vibrations in full-size crystalline silicon wafers”, Appl. Phys. Letters 88, 111907-1 (2006). The RUV approach for stress control in silicon wafers was also disclosed in the U.S. Pat. No. 6,413,789 B2 [S. Ostapenko “Method of detection and monitoring stresses in a semiconductor wafer” U.S. Pat. No. 6,413,789 B2. The method, as described in prior publications, allows for fast detection of wafer's imperfections but is not applicable for in line control. The method involves measurement of a single resonant curve and correlating one parameter of the curve with the internal stresses or cracks in a wafer. The wafers, however, vary in a range of physical parameters such as lateral dimensions, thickness, and shapes.

While small variations of these parameters are acceptable within the quality requirements for PV cells, these variations often lead to false positive events when an acceptable wafer is falsely recognized as a potentially breakable wafer with cracks. Further, the method is not capable to provide information in relation to the location of crack. Above mentioned shortcoming limit benefits of using the method of U.S. Pat. No. 6,413,789 for in-line quality control of wafers.

Another method, based on impact testing is disclosed in the U.S. Pat. No. 5,257,544 titled “Resonant frequency method for bearing ball inspection”. This invention provides a method for detecting defects in test objects which includes generating expansion inducing energy focused upon the test object at a first location, thereby causing pressure wave within the test object. At a second location, the acoustic waves are detected and the resonant frequencies' quality factors are calculated and compared to predetermined quality factor data. The inventors claim that such comparison provides information of whether the test object contains a defect. Once again, the method operates with a single rejection parameter, which, when applied to wafers, limits its ability to distinguish cracked samples from statistically variable samples, leading, therefore to high proportion of false positive event unacceptable in manufacturing practice. Further the method requires high precision in locating an incoming acoustic pulse (impact) and of a sensor detecting acoustic waves. This precludes identification of cracks located in proximity to the selected positions. Crucially, an impact testing by a single or multiple acoustic pulses is less sensitive than techniques based on periodical sinusoidal excitation. The periodic excitation allows for substantial reduction of signal-to-noise ratio by synchronizing frequency and phase of a detected response to an excitation with that of a reference signal causing the excitation. Furthermore, the impact testing has high probability to creating new cracks in standard silicon wafers when focused ultrasonic beam hit the wafer close to areas of high internal stress.

In my prior application Ser. No. 12/449,948 filed Sep. 4, 2009, I disclosed a fast, accurate and non-destructive determination of mechanical defects in wafers, including detecting and locating cracks in wafers, particularly applicable as a diagnostic in-line tool in solar cell production.

It is an object of the present invention to extend my prior invention to provide a fast, accurate and non-destructive determination of mechanical defects in composite materials, including detecting and locating cracks and del aminations in fuel cells and ceramic body armor.

The foregoing has outlined some of the more pertinent objects of the present invention. These objects should be construed as being merely illustrative of some of the more prominent features and applications of the invention. Many other beneficial results can be obtained by modifying the invention within the scope of the invention. Accordingly other objects in a full understanding of the invention may be had by referring to the summary of the invention, the detailed description describing the preferred embodiment in addition to the scope of the invention defined by the claims taken in conjunction with the accompanying drawings.

SUMMARY OF THE INVENTION

The present invention is defined by the appended claims with specific embodiments being shown in the attached drawings. The invention provides a method and apparatus for in-line detection and location of cracks in a thin wafer by exciting multiple mechanical vibrations in the wafer and measuring the response of the wafer at certain selected locations.

In its broadest aspect the present invention presents a method for in-line mechanical quality control of wafers, said method comprises the steps of:

-   -   coupling a wafer with a broad-band actuator,     -   providing at least one acoustic sensor adapted for measuring         vibrations at selected locations on the wafer,     -   measuring multiple resonant frequency curves by sweeping         frequency of the broad-band actuator simultaneously in         predetermined frequency intervals and     -   recording the wafer's resonance vibrations using the acoustic         sensor;     -   comparing the measured resonant frequency curves with reference         resonant frequency curves,     -   generating a rejection signal if the deviation between measured         and reference     -   resonant frequency curves exceeds a defined set of values, and     -   decoupling the wafer and the actuator.

In a preferred embodiment a resonance frequency, an amplitude and a bandwidth of each of the resonant curves are each compared with that of a reference resonance frequency curves.

In one embodiment according to this aspect of the invention, the method for in-line mechanical quality control of wafers is calibrated using a standard wafer. The standard wafer is carefully selected to be mechanically sound and crack free. The standard wafer is typically inspected using a range of the characterization methods known in the art, but not necessarily suitable for the requirements of fast in-line quality control.

The calibration of the method for in-line control of wafers includes the steps of:

-   -   Recording of a full range acoustic frequency spectrum of the         reference wafer;     -   Analysis of the spectrum, identification of resonance peaks and         selection of those peaks that are sensitive for cracks and other         mechanical defects that can cause the breakage of a wafer;     -   Selection of the required number and positions of the sensors,         depending on the quality requirements of the manufacturing         process that is to be controlled. While we found that in most         cases two separate sensors provide sufficient Data, it is         appreciated that the tougher the requirements for quality the         larger the number of sensors required;

Including a quality table of acceptable deviations into the defined set of values.

It is preferable to use a plurality of standard wafers to record statistical variations of the reference resonant curves caused by the factors not leading to breakage during high throughput manufacturing process. Such factors include, for example, small variations in lateral dimensions of wafer, its thickness, and shape. In some cases some small cracks are considered acceptable, especially when these cracks are located in non-critical parts of wafers. Therefore, it is preferable that plurality of standard wafers is selected to be representative in respect to a full batch excluding, of course, cracks that lead to the mechanical breakage. During the calibration each of the standard wafers is subjected to the same procedural steps as the tested wafer during in-line testing within a continuous manufacturing process. This excludes the step of comparing the resonant frequency curves and the step of generating the rejection signal.

In one embodiment, the statistical analysis of the reference resonant frequency curves comprises determination of statistical parameters listed in the following table.

TABLE 1 Statistical parameters of reference resonant frequency curves. Frequency of a resonance Amplitude Bandwidth A parameter of resonance f_(i) A_(i) BW_(i) curve of the i-th frequency interval Corresponding mean value f_(i) A_(i) BW_(i) determined from the standard frequency curves Standard deviation of the σ_(i) ^(f) σ_(i) ^(A) σ_(i) ^(BW) mean value Sensitivity factor n_(i) ^(f) n_(i) ^(A) n_(i) ^(BW)

In a preferred embodiment each of the multiple resonant frequency curves is analyzed to compute the parameters shown in the first raw of the table. The rejection signal is generated when the following conditions are simultaneously satisfied:

|f _(i) − f _(i) |>n _(i) ^(f) σf

|A _(i)− A _(i) |>n _(i) ^(A)σ_(i) ^(A)

|BW _(i) − BW _(c) |n _(i) ^(BW)σ_(i) ^(BW)

The coefficients n_(i) are chosen in accordance with a selected detection limit and with an acceptable number of false rejections. It is appreciated that the lower the detection limit the higher the number of false rejects. The invention provides for adjusting the coefficients n_(i) depending on specific requirements of a particular manufacturing process. The detection limit is preferably the minimum size of a crack, which, if detected in a wafer, causes generation of the rejection signal.

In a further embodiment, prior to coupling with the actuator and after completion of the measurements, the wafer progresses through a manufacturing line; the manufacturing line usually comprises a number of manufacturing processes.

In a typical arrangement, the manufacturing line includes a movable platform, a conveyer belt, pick-and-place mechanisms or any other transportation means used in such continuous manufacturing processes, and the wafer is engaged with the transportation means.

The wafer coupled with the actuator is preferably disengaged from the transportation means.

In a still further embodiment the coupling and decoupling the wafer and the actuator is synchronized with the operation of the transportation means. It is essential to achieve an in line integration of the quality testing procedure. In one example, the transportation means remain motionless during the recording of the resonant frequency curves. In another example, the movement of the transportation means just slows down. It is preferable that when the recording and analysis of the resonant frequency curve is completed and the wafer is about to be decoupled from the actuator, the next subsequent wafer is in proximity to the actuator, so that the in-line quality control procedure can be applied to the next wafer without undue delay.

In a yet further embodiment the coupling of the wafer and the actuator is achieved by a high speed electronically controlled coupling means such as electrostatic chuck, utilizing electrostatic attraction, magnetic coupling, injecting a coupling fluid, or any other coupling means known in the art of acoustic measurements. In a preferred arrangement the coupling means is an electronically controlled vacuum switch creating a vacuum in the space between the wafer and the actuator so that the wafer is coupled with the actuator by action of vacuum force.

Typically the actuator comprises a piezoelectric generator of acoustic wave and a body on which the generator is mounted. The invention provides for an arrangement where the wafer coupled with the actuator is mechanically supported by the actuator during the measurement of the resonant frequency curves. In one realization the wafer rests on the actuator. In another arrangement the wafer is suspended beneath the actuator.

In another embodiment, the rejection signal initiates transferring of the wafer to the separating means. In the absence of the rejection signal the accepted wafer is either returned to the transportation means, from which it was disengaged prior to the measurements or is moved to another transportation means. In both cases the transportation means transfer the wafer through stages of a manufacturing process. If, however, the wafer was determined to be not suitable for further stages of manufacture, it is transferred to the separation means.

Similarly to the transportation means, the separation means may comprise a conveyer belt, a pick-and-place mechanism, movable platform, or even a stack or a cassette where the rejected wafers are collected.

To minimize false positive decisions when an acceptable wafer is mistakenly transferred to the separation means, the invention provides for an additional step of inspecting the rejected wafer. It is appreciated that only a small proportion of the wafers will be rejected and, therefore, the step of inspecting the rejected wafer does not need to satisfy stringent requirements of in-line procedures, such as fast handling and short duration of time intervals required for collection and processing of data. The inspection of the rejected wafer preferably comprises an imaging technique, such as, for example, luminescence.

In a still another embodiment, if the inspection of the rejected wafer determines that the reject signal was false, the wafer is returned to the transportation means and the statistical parameters, including the defined set of values, are adjusted to accommodate the new reference information.

In a yet another embodiment vibrations of the wafer are simultaneously detected in at least two differing selected positions of the wafer by at least two separate acoustic sensors. The sensors may be in a contact with the wafer at selected locations or alternatively may be placed proximate the selected positions. In the latter case the wafer's vibrations can be detected by one of the known means including, for example, monitoring the position or the direction of a reflected laser beam. It is preferable to choose the selected positions on the wafer's periphery.

In some cases, in particular, when a decision to accept/reject the wafer is on the boundary of accept/reject conditions the method may include relocating the sensors to new selected positions and repeating the measurements of the resonant frequency curves.

From another aspect, the invention provides an apparatus for in-line quality control of wafers comprising:

-   -   A broad band acoustic actuator capable of exciting mechanical         vibrations in a wafer simultaneously in the predetermined         frequency ranges.     -   At least one acoustic sensor capable for detecting mechanical         vibrations in the wafer and converting the vibrations into         electrical signals     -   At least two electrical generators jointly delivering the         superposition of the electrical signals to the acoustic actuator     -   At least two electrical amplifiers each synchronized with the         corresponding electrical generator and tuned to measure the         vibrations of the wafer in one of the predetermined frequency         ranges     -   Data acquisition and control system and     -   A means for fast coupling the wafer with the actuator.

In one embodiment, the apparatus further comprises a transportation means for transferring the wafer prior to coupling the wafer and the actuator. The transportation means is preferably adapted to disengage the wafer for the measurement of the resonant frequency curves.

In another embodiment, the data acquisition and control system is adapted to synchronize the transportation means with the means for fast coupling the wafer and the actuator.

In yet another embodiment, the apparatus further includes a means for positioning the sensors at the selected locations of the wafer.

In a further embodiment, the apparatus further includes the means for fast coupling the wafer and the actuator. The means for fast coupling the wafer and the actuator preferably comprises a fast electronically controlled vacuum switch, so that the wafer is mechanically coupled with the actuator by the action of a pressure differential created between the outer side of the wafer facing the atmosphere, and the inner side facing the actuator. In one realization, the pressure differential is applied to the wafer through a small hole created in the actuator.

After the resonant frequency curves are detected, the wafer may be uncoupled from the actuator and returned to the manufacturing line. This is commonly achieved by returning the wafer to the transportation means.

However, if the wafer fails quality requirements and is found to be not suitable for further manufacturing steps, the wafer may be removed from the processing line and, for example, placed in the separation means designated for reworking or disposal.

In an alternative arrangement, the wafer is in a stack of wafers and is taken from the stack for coupling with the actuator. If the wafer complies with the quality requirements it may be returned to the original stack, placed into another stack or transferred onto the transportation means. If, however, the wafer fails the quality requirements, it may be, for example, transferred to a container or yet another stack designated for reworking or disposal.

Based on the decision on the quality of the wafer an electrical signal may be generated to either keep the wafer within the manufacturing line or to remove the wafer from the manufacturing line.

In one embodiment of the invention, the invention is incorporated into a method for testing for delamination of a first composite component from a second composite component in a composite material. The method for testing comprises the steps of coupling a broad-band actuator to the composite material and connecting sweeping frequencies to the broad-band actuator for vibrating the composite material. At least one acoustic sensor is coupled to the composite material for measuring a peak frequency, an amplitude and a bandwidth of a resonant frequency curve of the vibrating composite material. The measured peak frequency, amplitude and bandwidth of the resonant frequency curve of the vibrating composite material is compared with a peak frequency, amplitude and bandwidth of a reference resonant frequency curve. A delaminated composite material produces a change in one of the measured peak frequency, amplitude and bandwidth of the resonant frequency curve relative to the frequency, amplitude and bandwidth of the reference resonant frequency curve.

In another embodiment, the invention is incorporated into a method for testing for delamination of a first composite component from a second composite component a body armor composite material. The method comprises the steps of coupling a broad-band actuator to the body armor composite material and connecting sweeping frequencies to the broad-band actuator for vibrating the body armor compos material. At least one acoustic sensor is coupled to the body armor composite material for measuring a peak frequency, an amplitude and a bandwidth of a doublet resonant frequency curve of the vibrating body armor composite material. The measured peak frequency, amplitude and bandwidth of the doublet resonant frequency curve of the vibrating body armor composite material is compared with a peak frequency, amplitude and bandwidth of a reference doublet resonant frequency curve. A delaminated body armor composite material produces a change in one of the measured peak frequency, amplitude and bandwidth of the doublet resonant frequency curve relative to the frequency, amplitude and bandwidth of the reference doublet resonant frequency curve.

In still a further embodiment, the invention is incorporated into a method for testing for delamination of an electrode component in a composite fuel cell. The method comprises the steps of coupling a broad-band actuator to the composite material and connecting sweeping frequencies to the broad-band actuator for vibrating the composite fuel cell. At least one acoustic sensor is coupled to the composite fuel cell for measuring a peak frequency of a resonant frequency curve of the vibrating composite fuel cell. The measured peak frequency of the resonant frequency curve of the vibrating composite fuel cell is compared with a peak frequency of a reference resonant frequency curve. A delaminated composite fuel cell produces a change in the measured peak frequency of the resonant frequency curve relative to the frequency, amplitude and bandwidth of the reference resonant frequency curve.

The foregoing has outlined rather broadly the more pertinent and important features of the present invention in order that the detailed description that follows may be better understood so that the present contribution to the art can be more fully appreciated. Additional features of the invention will be described hereinafter which form the subject of the claims of the invention. It should be appreciated by those skilled in the art that the conception and the specific embodiments disclosed may be readily utilized as a basis for modifying or designing other structures for carrying out the same purposes of the present invention. It should also be realized by those skilled in the art that such equivalent constructions do not depart from the spirit and scope of the invention as set forth in the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

For a fuller understanding of the nature and objects of the invention, reference should be made to the following detailed description taken in connection with the accompanying drawings in which:

Other advantages of the present invention will be readily appreciated as it becomes better understood by referring to the following detailed description when considering the accompanying drawings wherein:

FIG. 1 is a diagram showing a method for quality control of wafers according to the first example of the invention.

FIG. 2 is a diagrammatic cross-sectional representation of an apparatus for in-line mechanical quality control of wafers according to the second example of the invention.

FIG. 3 is a diagrammatic top-view representation of a device for in-line mechanical quality control of wafers according to the third example of the invention

FIG. 4 is a full range ultrasonic frequency spectrum obtained on a crack-free reference wafer, showing four individual vibration modes A, B, C and D according to the fourth example of the invention.

FIG. 5 is a comparison of the resonance frequency curves on the reference wafer and the wafer with a crack according to the fifth example of the invention.

FIG. 6 is a dependence of peak-shift at selected frequencies, on the size of a crack according to the sixth example of the invention.

FIG. 7 demonstrates the effect on the position, shape and amplitude of the resonance peaks by cracks in a wafer according to the seventh example of the invention.

FIG. 8 demonstrates commonly used shapes of wafers and corresponding shapes of the actuators according to the eights example of the invention.

FIG. 9 is a diagrammatic representation of a four-sensor apparatus according to the ninth example of the invention.

FIG. 10 depicts resonance peaks obtained from measurements made at the four sides of a square wafer according to the tenth example of the invention.

FIG. 11 is a flow-chart diagram of a method for quality control of wafer according to the eleventh example of the invention.

FIG. 12 is a flow-chart diagram of a calibration procedure according to the twelfth example of the invention.

FIG. 13 is a histogram demonstrating a statistical distribution of bandwidths of a set of 282 125 by 125 mm wafers according to the thirteenth example of the invention.

FIG. 14 depicts normal distribution of resonance frequency (a), bandwidth and amplitude (c) according to the fourteenth example of the invention.

FIG. 15 demonstrates a statistical analysis performed on a set of 125 mm Si solar Cell.

FIG. 16 is an isometric view of a fuel cell of the prior art.

FIG. 17 is a side view of composite material comprising an anode bonded to an electrolyte.

FIG. 18 is graph of peak position frequency as a function of tested anode cell number illustrating the distinction of the normal anode cells and delaminated anode cells.

FIG. 19 is a graph illustrating the resonance of a good fuel cell and a delaminated fuel cell.

FIG. 20 is a side view of a composite material comprising a ceramic bonded to a polymeric forming a ceramic body armor.

FIG. 21 is a normalized graph of a first set of composite ceramic body armor showing charactistic of good plates.

FIG. 22 is a normalized graph of a second set of composite ceramic body armor showing charactistic of good plates.

FIG. 23 is a normalized graph of a third set of composite ceramic body armor showing charactistic of good plates.

FIG. 23 is a normalized graph of a fourth set of composite ceramic body armor showing charactistic of cracked or del aminated plates.

FIG. 25 shows the distribution of the position of peak A.

FIG. 26 shows the distribution of bandwidth of peak A.

FIG. 27 shows the distribution of amplitude of peak A.

FIG. 28 shows the distribution of the position of peak B.

FIG. 29 shows the distribution of bandwidth of peak B.

FIG. 30 shows the distribution of amplitude of peak B.

FIG. 31 illustrates a fitting procedure to obtain parameters of the A and B peaks.

Similar reference characters refer to similar parts throughout the several Figures of the drawings.

DETAILED DISCUSSION

The chosen first example of the invention, shown in FIG. 1 includes a generator subsystems 4 comprising a number of generators X1, X2, . . . XN, Y1, Y2 . . . YK, each tuned to a certain frequency range and each controlled by a data acquisition and control subsystem. Each of the generators is synchronized with a corresponding amplifier either from a subsystem 4X connected to a sensor 12X, which detects vibrations of a wafer 10 in the X-direction, or from a subsystem 4Y, connected to a sensor 12Y, which detects vibrations of the wafer 10 in the Y-direction.

It is common for the predetermined frequency range of X-generators to be similar or even identical to that of the analogues Y-generators, such that the generators X1 and Y1 may operate in the same range of frequencies. However, each of the X-generators operates in a different frequency range. The number of generators depends on the number of resonance peaks to be recorded. The number N of X-generators is not necessarily the same as the number K of Y-generators.

The generators 4 are electrically connected to an actuator 11 that is acoustically coupled to a wafer 10. The actuator and the sensors arc typically piezoelectric devices. The actuator is a linear device, so that a superposition (linear combination) of independent electrical signals generated by X- and Y-generators is converted by the actuator to a superposition (linear combination) of acoustic vibrations at frequencies identical to frequencies of the independent electrical signals superimposed by the actuator.

In operation, a data acquisition and control subsystem 5 effects the generators 4 to sweep the frequency of generated electrical voltage in a range predetermined for each generator. This causes the actuator 11 to vibrate according to a superposition of signals created by the generators. The actuator 11, in turn, causes ultrasonic vibrations in the wafer 10. The vibrations are measured by the sensors 12X and 12Y and further amplified by the amplifiers 4X and 4Y for acquisition by the data acquisition and control subsystem 5. In this way, individual frequency sweeps from each generator are transferred to corresponding vibration modes of the wafer and these vibration modes are recorded independently from each other and simultaneously by the sensors 12X and 12Y.

An apparatus for in-line mechanical quality control of wafers of the second example, shown schematically in FIG. 2, comprises a vacuum holder 21; a piezoelectric actuator 25, supported by the vacuum holder 21 and acoustically coupled to a wafer 20; a sensor 22, acoustically coupled to the periphery of the wafer 20; a vacuum pump 24; an electronically controlled vacuum switch 23; and an electronic block 26, that includes a generator, an amplifier, and a data acquisition and control subsystem.

The actuator 25 has a small central hole allowing a reliable vacuum coupling between the wafer and the actuator by applying small (about 50 kPa) negative pressure to the back side of the wafer.

In operation, the vacuum pump 24 is switched on permanently and the vacuum switch 23 is initially in the closed position. When the wafer 20 is positioned on the actuator 25 the electronic block 26 opens the vacuum switch 23 and the negative pressure created at the back side of the wafer 20 ensures coupling of the wafer 20 and the actuator 25. The sensor 22 approaches the wafer 20 and contacts the wafers edge at a selected location. The electronic block 26 immediately commences sweeping frequency simultaneously at a number of predetermined frequency ranges. The actuator 25 vibrates causing ultrasonic vibrations in the wafer 20; the sensor 22 converts these vibrations into electrical voltage that is in turn amplified, acquired and analyzed by the electronic block 26. By comparing the measured resonant frequency curves with reference resonant frequency curves the electronic block 26 makes a rejection-acceptance decision. When the measurements are completed, the electronic block 26 closes the vacuum switch 23; the wafer 20 can now be removed from the apparatus and depending on the rejection-acceptance decision either returned to the conveyer line for further processing or placed aside for reworking or disposal.

In a preferred arrangement, the wafer is on a transportation means, typically—on a conveyer belt (not shown), prior to coupling the wafer and the actuator. The transportation means may stop for a short time required for the measurement. Typically the transportation means has an opening and the wafer is transported in such a way that the opening is below and close to the centre of the wafer. The vacuum holder 21 supporting the actuator 25 is attached to a Z-stage (not shown) positioned below the transportation means. The Z-stage moves the vacuum holder 21 upwards until the actuator is in contact with the wafer. This is followed by opening the vacuum switch 23 to provide a pressure differential sufficient for acoustic coupling the actuator and the wafer. Optionally the Z-stage may thither raise the vacuum holder 21 such that the wafer mechanically supported by the actuator is raised above the conveyer belt. The sensor 22 is now in contact with the wafer's edge. When the measurements are completed, the data acquisition and control system switches the vacuum switch off; this removes the pressure differential and decouples the wafer 20 and the actuator 25. Prior to that the system may cause the Z-stage to lower the wafer back to the conveyer belt. The vacuum holder 21 is then transferred to its position below the transportation means while the wafer 20 is returned to the transportation means. If however; the rejection signal is generated, the wafer may be removed from the transportation means sideways. The transportation means recommences its movement until the next wafer is brought to a measurement position above the vacuum holder. The transportation means stops at this position and the measurements are now repeated with another wafer. In this way the in-line mechanical quality control of wafers is conducted.

A horizontal double-sided arrow in FIG. 2 shows directions of movement of the sensor 22 towards (before measurements) and away from (after measurements) the wafer 20, whereas a vertical double sided arrow shows the directions of movement of the actuator 25, attached to the vacuum holder 21, upwards towards the wafer 20 and then upwards with the wafer 20 (before the measurements); and downwards with the wafer 20, and, after the wafer 20 rests on the transportation means, further downwards bellow the transportation means (after the measurements).

An apparatus of the third example of the invention is shown in FIG. 3. A wafer 30 is shown in 3 separate positions: before the test (30 a), during the test (30 b), and after the test (30 c).

The wafer is transported by a conveyer belt 34. During the test the wafer enters the measuring unit 37, where it is acoustically coupled with an actuator 31 and a sensor 32. After completion of the test the wafer 30 is returned to the conveyer belt 34.

FIG. 4 is a calibration frequency scan recorded on a crack-free standard wafer in the frequency range from 20 to 93 kHz. As shown, four separate resonance peaks, labeled as A, B, C and D, are recorded and selected for in-line mechanical quality control of wafers. FIG. 5 shows experimental verification of the invention. Two identical in size and shape 125 mm by 125 mm square shaped single-crystal silicon wafers were tested. One of these wafers is a standard wafer (closed marks), having no mechanical or structural defects such as cracks, that was confirmed by Scanning Acoustic Microscopy imaging with 10 microns resolution. The second wafer (open marks) has a 3 mm peripheral crack introduced at the center of the wafer's edge. The effect of the crack is clearly observed as a downward frequency shift, reduction of the peak amplitude and increased peak bandwidth (peak broadening).

FIG. 6 demonstrates that in-line mechanical quality control of wafers is capable for detecting dimensions of cracks in a wafer and distinguishing between cracks at the centre of the wafer edge and that at its corner. In this example peak shifts (difference between the measured resonance frequency and the reference resonant frequency) measured at three different resonances (at 40 kHz, 58 kHz and 86 kHz) arc presented as functions of the length of a crack. The example demonstrates that 86 kHz resonance is preferable for the detection of cracks close to the centre of the wafer's edge, whereas 58 kHz is more suitable for the detection of cracks positioned in the proximity of the wafer's corners. At least two separate resonances are therefore required to indicate the position of a crack on a wafer edge. An example of FIG. 7 shows resonance peaks recorded for a standard wafer (closed marks) and a cracked wafer (open marks). A resonance at around 56.3 kHz is shown in FIG. 7 a, and at around 87.6 kHz—in FIG. 7 b. A 6 mm crack positioned closed to the centre of the wafer's edge resulted in a small 18 Hz frequency shift at the 55.3 kHz resonance, and in a substantial 600 Hz downward frequency shift at the 876 kHz resonance. The method for in-line mechanical quality control of wafers would reject this wafer from further processing.

Three different examples of actuators are shown in the FIG. 8. An arrangement when the shape of a transducer is similar to the shape of a wafer usually results in better acoustic matching and is preferred. A circular actuator is preferable for use with a circular wafer (FIG. 8 a), a square actuator—with as square wafer (FIG. 8 b) and a rectangular actuator—with a rectangular wafer (FIG. 8 c). FIG. 8 also demonstrates that in a preferable arrangement a transducer is coupled to the geometrical centre of a wafer.

Yet another example of the invention is shown diagrammatically in FIG. 9. An apparatus of this example comprises four sensors 82, each adapted to measure mechanical vibration of a square wafer 30 at approximately the centre of each side of the square. The sensor 82N measures at the north side of the wafer, sensor 82S—at the south side and so on. An actuator 81, acoustically coupled to the wafer 80, is controlled by an electronic block 86. The electronic block 86 is adapted to sweep frequency in two independent intervals and to collect resonant frequency curves from four separate sensors. Therefore, the block 86 comprises two generators and two groups of amplifiers (four amplifiers in each group). Each amplifier horn the first group is synchronized with the first generator to measure the first vibration resonance and, similarly, each amplifier from the second group is synchronized with the second generator to measure the second resonance.

In operation, the first and the second generators sweep the frequency around the first and the second resonance peaks correspondingly, causing vibration of the actuator, which in turn excites vibrations of the water. If the wafer is free of defects, the resonance peaks detected at each of N, S, W, E sides of the wafer are identical at each of the preselected resonances. If, however, one of the sides contains defects the resonance peak measured at that side may deviate from those measured at the other three sides of the wafer.

FIG. 10 shows data obtained experimentally by measuring two vibration resonances at each of four sides (N, S, W, E) of a 125 mm by 125 mm square wafer. In FIG. 10( a) a resonance peak at 36 kHz is measured at the centers of four different sides (East, North, South and West) of the wafer. All four resonance peaks have close values of amplitude, peak position and bandwidth.

In FIG. 10( b) the same measurements were repeated at a different resonance peak of 88.6 kHz. Evidently, in this case the amplitude and shape of signals are quite different. The South side has the smallest resonance peak amplitude due to mechanical defects on this side. Therefore, method and apparatus of the invention allow not only to detect the presence of mechanical defects in a wafer, but also to determine their geometrical location. FIG. 11 and FIG. 12 depict flow-chart diagrams and include procedures typically implemented in the invention.

With respect to FIG. 13 the histogram depicts statistical distribution of bandwidth of measured resonant frequency curves of a set of identical as-cut 286 cast wafers selected from a single batch. The distribution is approximated by Gaussian curve and has the following parameters: mean value—90.4 Hz, standard deviation −33 Hz. The wafers with bandwidth outside (3σ) interval around the mean value were rejected.

FIG. 14 shows a normal distribution of one of rejection parameters of the method, i.e. the resonance frequency, the amplitude of the bandwidth on a set of standard wafers. Internal part of the normal distribution is less than one standard deviation (σ) from the mean (μ). For the normal distribution, this account for 68.2% of entire set of wafers, while two standard deviations (2σ) from the mean value account for 95.4% and three standard deviations account for 99.6%.

FIG. 15 demonstrates an importance of the simultaneous application of rejection criteria. Only cells which fall outside (3σ) thresholds for at least 2 of 3 rejection criterion were considered rejects. These cells (#2, 26, 43. 54 and 62) were independently measured using a Scanning Acoustic Microscope, which revealed cracks in the range of lengths from 3 mm to 50 mm. The invention has been described in an illustrative manner and it is to be understood that the terminology that has been used is intended to be in the nature of words of description rather than of limitation. It is now apparent to those skilled in the art that many modifications and variations of the present invention are possible in light of the above teachings. It is, therefore, to be understood that the invention may be practiced otherwise than as specifically described.

Fuel Cell

FIG. 16 is an isometric view of a fuel cell 100 of the prior art. The fuel cell 100 comprises an anode 101 and a cathode 102 separated by a ceramic electrolyte membrane 103. Backing layers 105 and 106 located adjacent to the anode 101 and cathode 102. The anode 101 and cathode 102 are bonded to the ceramic electrolyte membrane 103. The operation of the fuel cell 100 should be well known to those skilled in the art.

FIG. 17 is a side view of the anode 101 bonded to the ceramic electrolyte membrane 103. The bond between the anode 101 and the ceramic electrolyte membrane 103 is weak and subject to delamination. Delamination of the bond between the anode 101 and the ceramic electrolyte membrane 103 results to deterioration and/or failure of the fuel cell 100. A delamination of the bond between the cathode 102 and the ceramic electrolyte membrane 103 results in a similar deterioration and/or failure of the fuel cell 100. The geometry of the anode 101 and the ceramic electrolyte membrane 103 permits the ultrasonic testing using the apparatus shown in FIGS. 1-3. The test data positively demonstrates that ultrasonic testing is capable of detecting cracks and delamination in anodes 101 of fuel cell.

FIG. 18 is graph of peak position frequency as a function of tested anode cell number illustrating the distinction of the normal anode cells and delaminated anode cells. The delaminated anode cells 15-27 exhibit a substantial change in peak position frequency relative to the normal anode cells 1-13. In contrast to the silicon wafers previously set forth, the delaminated anode cells exhibit a little change in bandwidth frequency and frequency amplitude relative to the normal anode cells. Ultrasonic testing of cracked and/or delamination in anodes 101 of fuel cell exhibit a single resonance peak that is frequency shifted relative to a normal anode 101 of fuel cell.

FIG. 19 is a graph illustrating the resonance of a good fuel cell and a delaminated fuel cell.

Body Armor

FIG. 20 is a side view of a composite material 110 comprising a ceramic 111 bonded to a polymeric material 112. The composite material 110 is curved for forming ceramic body armor 115. The combination of the ceramic material 111 bonded to the polymeric material 112 provides composite ceramic body armor 115 for protection from ballistic and shrapnel impact. Unfortunately, if the bond between the ceramic material 111 and the polymeric material 112 is compromised, the body armor 115 loses substantial strength against ballistic and shrapnel impact. In some cases, a delamination between the ceramic material 111 and the polymeric material 112 is a result of manufacturing defects. In other cases, delamination between the ceramic material 111 and the polymeric material 112 is a result a prior impact.

At the present time, there is no efficient, nondestructive and reliable method of determining delamination of composite ceramic body armor 115. The only simple way of determining delamination of composite ceramic body armor 115 is to knock composite ceramic body armor 115 and listen for the sound from the composite ceramic body armor 115. Unfortunately, the knock method of testing composite ceramic body armor 115 is not a reliable test.

The composite ceramic body armor 115 is shown mounted on an adapter plate 120 for coupling the curved geometry of the composite ceramic body armor 115 to an ultrasonic transducer 125. The ultrasonic transducer 125 is connected to the apparatus shown in FIGS. 1-3.

The automated feeding mechanism shown in FIGS. 1-3 is modified for accommodating the curved geometry of the composite ceramic body armor 115. In the alternative, a suspected composite ceramic body armor 115 maybe hand applied to the adapter plate in a field testing ultrasonic apparatus (not shown).

Resonance ultrasonic vibrations scans measured in wide frequency range between 30 and 100 KHz on 2 groups of plates—good plates (a) and bad plates (b). All good plates have general similarity with regards to A and B peaks. Similar measurements were performed on all 30 (good)+6 (bad) plates. We noticed that though the features at higher frequencies 90-94 KHz show noticeable amplitude in some plates, they do not represent individual peaks and therefore did not get used for statistical analysis.

FIGS. 21-24 shown all 36 plates measured in the range from 30 to 60 KHz. For comparison purposes, all scans were normalized to the maximum value. It is obvious that bad plates show qualitative difference from good plates. To quantify this difference we performed statistical evaluation of good plates of all 3 parameters.

FIG. 21-24 illustrate resonance ultrasonic vibrations scans with zoom on A and B peak. FIGS. 21-23 Show characteristic of good plates while FIG. 24 show characteristic of cracked or deliminated plates.

FIGS. 25-30 show the distributions of peak position, bandwidth and amplitude for A and B peaks. Each peak was fitted with single Lorenz curve with example shown in FIG. 31. Additionally, the plate with s/n 3287349 in FIG. 28 was identified as suspect, based on extremely large value of the bandwidth in the peak B. This was re-confirmed with control resonance ultrasonic vibrations scan on this plate.

FIG. 31 illustrates a fitting procedure to obtain parameters of the A and B peaks.

The present disclosure includes that contained in the appended claims as well as that of the foregoing description. Although this invention has been described in its preferred form with a certain degree of particularity, it is understood that the present disclosure of the preferred form has been made only by way of example and that numerous changes in the details of construction and the combination and arrangement of parts may be resorted to without departing from the spirit and scope of the invention. 

1. A method for testing for delamination of a first composite component from a second composite component of a composite material, comprising the steps of: coupling a broad-band actuator to the composite material; connecting sweeping frequencies to the broad-band actuator for vibrating the composite material; coupling at least one acoustic sensor to the composite material for measuring a peak frequency, an amplitude and a bandwidth of a resonant frequency curve of the vibrating composite material; comparing the measured peak frequency, amplitude and bandwidth of the resonant frequency curve of the vibrating composite material with a peak frequency, amplitude and bandwidth of a reference resonant frequency curve; and indicating a delaminated composite material in the event the composite material produces a change in one of the measured peak frequency, amplitude and bandwidth of the resonant frequency curve relative to the frequency, amplitude and bandwidth of the reference resonant frequency curve.
 2. A method for testing for delamination as set forth in claim 1, wherein the step of coupling at least one acoustic sensor to the composite material includes coupling at least one acoustic sensor to a periphery of the composite material.
 3. A method for testing for delamination as set forth in claim 1, wherein the step of coupling at least one acoustic sensor to the composite material includes coupling at least one acoustic sensor to a lateral side of the composite material.
 4. A method for testing for delamination as set forth in claim 1, wherein step of coupling at least one acoustic sensor to the composite material includes coupling at least one acoustic sensor by a vacuum coupling.
 5. A method for testing for delamination as set forth in claim 1, wherein step of coupling at least one acoustic sensor to the composite material includes coupling at least one acoustic sensor below the composite material.
 6. A method for testing for delamination as set forth in claim 1, wherein step of connecting sweeping frequencies includes delivering a superposition of the electrical signals to said acoustic actuator,
 7. A method for testing for delamination as set forth in claim 1, including rejecting the composite material in the event the composite material produces a change in any two of the measured peak frequency, amplitude and bandwidth of the resonant frequency curve relative to the peak frequency, amplitude and bandwidth of the reference resonant frequency curve.
 8. A method for testing for delamination as set forth in claim 1, including rejecting the composite material in the event the composite material produces a change in the measured peak frequency of the reference resonant frequency curve.
 9. A method for testing for delamination of an electrode component in a composite fuel cell, comprising the steps of: coupling a broad-band actuator to the composite material; connecting sweeping frequencies to the broad-band actuator for vibrating the composite fuel cell; coupling at least one acoustic sensor to the composite fuel cell for measuring a peak frequency, an amplitude and a bandwidth of a resonant frequency curve of the vibrating composite fuel cell; comparing the measured peak frequency, amplitude and bandwidth of the resonant frequency curve of the vibrating composite fuel cell with a peak frequency, amplitude and bandwidth of a reference resonant frequency curve; and indicating a delaminated composite fuel cell in the event the composite fuel cell produces a change in the measured peak frequency relative to the measured peak frequency of the reference resonant frequency curve.
 10. A method for testing for delamination of a first composite component from a second composite component of a body armor composite material, comprising the steps of: coupling a broad-band actuator to the body armor composite material; connecting sweeping frequencies to the broad-band actuator for vibrating the body armor composite material; coupling at least one acoustic sensor to the body armor composite material for measuring a peak frequency, an amplitude and a bandwidth of a doublet resonant frequency curve of the vibrating body armor composite material; comparing the measured peak frequency, amplitude and bandwidth of the doublet resonant frequency curve of the vibrating body armor composite material with a peak frequency, amplitude and bandwidth of a reference doublet resonant frequency curve; and indicating a delaminated body armor composite material in the event the body armor composite material produces a change in one of the measured peak frequency, amplitude and bandwidth of the doublet resonant frequency curve relative to the frequency, amplitude and bandwidth of the reference doublet resonant frequency curve. 